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high bandwidth single supply operational amplifiers d suffix plastic package case 751 (so8) p suffix plastic package case 626 d suffix plastic package case 751a (so14) p suffix plastic package case 646 pin connections (single, top view) (dual, top view) offset null v ee nc v cc output offset null inputs v ee inputs 1 inputs 2 output 2 output 1 v cc inputs 1 output 1 v cc inputs 2 output 2 output 4 inputs 4 v ee inputs 3 output 3 (quad, top view) 4 2 3 1 inputs 3 1 2 3 4 8 7 6 5 + + 1 2 3 4 8 7 6 5 pin connections 1 2 3 4 5 6 78 9 10 11 12 13 14 + + + + + 1 8 1 8 14 1 14 1 2272 motorola analog ic device data "
" !# quality bipolar fabrication with innovative design concepts are employed for the mc33071/72/74, mc34071/72/74 series of monolithic operational amplifiers. this series of operational amplifiers offer 4.5 mhz of gain bandwidth product, 13 v/ m s slew rate and fast setting time without the use of jfet device technology. although this series can be operated from split supplies, it is particularly suited for single supply operation, since the common mode input voltage range includes ground potential (v ee ). with a darlington input stage, this series exhibits high input resistance, low input offset voltage and high gain. the all npn output stage, characterized by no deadband crossover distortion and large output voltage swing, provides high capacitance drive capability, excellent phase and gain margins, low open loop high frequency output impedance and symmetrical source/sink ac frequency response. the mc33071/72/74, mc34071/72/73 series of devices are available in standard or prime performance (a suffix) grades and are specified over the commercial, industrial/vehicular or military temperature ranges. the complete series of single, dual and quad operational amplifiers are available in plastic dip and soic surface mount packages. ? wide bandwidth: 4.5 mhz ? high slew rate: 13 v/ m s ? fast settling time: 1.1 m s to 0.1% ? wide single supply operation: 3.0 v to 44 v ? wide input common mode voltage range: includes ground (v ee) ? low input offset voltage: 3.0 mv maximum (a suffix) ? large output voltage swing: 14.7 v to +14 v (with 15 v supplies) ? large capacitance drive capability: 0 pf to 10,000 pf ? low total harmonic distortion: 0.02% ? excellent phase margin: 60 ? excellent gain margin: 12 db ? output short circuit protection ? esd diodes/clamps provide input protection for dual and quad ordering information op amp function device operating temperature range package single mc34071p, ap mc34071d, ad t a = 0 to +70 c plastic dip so8 mc33071p, ap mc33071d, ad t a = 40 to +85 c plastic dip so8 dual mc34072p, ap mc34072d, ad t a = 0 to +70 c plastic dip so8 mc33072p, ap mc33072d, ad t a = 40 to +85 c plastic dip so8 quad mc34074p, ap mc34074d, ad t a = 0 to +70 c plastic dip so14 mc33074p, ap mc33074d, ad t a = 40 to +85 c plastic dip so14
mc34071,2,4,a mc33071,2,4,a 2273 motorola analog ic device data maximum ratings rating symbol value unit supply voltage (from v ee to v cc ) v s +44 v input differential voltage range v idr note 1 v input voltage range v ir note 1 v output short circuit duration (note 2) t sc indefinite sec operating junction temperature t j +150 c storage temperature range t stg 60 to +150 c notes: 1. either or both input voltages should not exceed the magnitude of v cc or v ee . 2. power dissipation must be considered to ensure maximum junction temperature (t j ) is not exceeded (see figure 1). offset null (mc33071, mc34071 only) q1 q2 q3 q4 q5 q6 q7 q17 q18 d2 c2 d3 r6 r7 r8 r5 q15 q16 q14 q13 q11 q10 r2 c1 r1 q9 q8 q12 d1 r3 r4 inputs v cc output current limit v ee /gnd base current cancellation + q19 bias representative schematic diagram (each amplifier)
mc34071,2,4,a mc33071,2,4,a 2274 motorola analog ic device data electrical characteristics (v cc = +15 v, v ee = 15 v, r l = connected to ground, unless otherwise noted. see note 3 for t a = t low to t high ) a suffix nonsuffix characteristics symbol min typ max min typ max unit input offset voltage (r s = 100 w , v cm = 0 v, v o = 0 v) v cc = +15 v, v ee = 15 v, t a = +25 c v cc = +5.0 v, v ee = 0 v, t a = +25 c v cc = +15 v, v ee = 15 v, t a = t low to t high v io e e e 0.5 0.5 e 3.0 3.0 5.0 e e e 1.0 1.5 e 5.0 5.0 7.0 mv average temperature coefficient of input offset voltage r s = 10 w , v cm = 0 v, v o = 0 v, t a = t low to t high d v io / d t e 10 e e 10 e m v/ c input bias current (v cm = 0 v, v o = 0 v) t a = +25 c t a = t low to t high i ib e e 100 e 500 700 e e 100 e 500 700 na input offset current (v cm = 0 v, v o = 0v) t a = +25 c t a = t low to t high i io e e 6.0 e 50 300 e e 6.0 e 75 300 na input common mode voltage range t a = +25 c t a = t low to t high v icr v ee to (v cc 1.8) v ee to (v cc 2.2) v ee to (v cc 1.8) v ee to (v cc 2.2) v large signal voltage gain (v o = 10 v, r l = 2.0 k w ) t a = +25 c t a = t low to t high a vol 50 25 100 e e e 25 20 100 e e e v/mv output voltage swing (v id = 1.0 v) v cc = +5.0 v, v ee = 0 v, r l = 2.0 k w , t a = +25 c v cc = +15 v, v ee = 15 v, r l = 10 k w , t a = +25 c v cc = +15 v, v ee = 15 v, r l = 2.0 k w , t a = t low to t high v oh 3.7 13.6 13.4 4.0 14 e e e e 3.7 13.6 13.4 4.0 14 e e e e v v cc = +5.0 v, v ee = 0 v, r l = 2.0 k w , t a = +25 c v cc = +15 v , v ee = 15 v, r l = 10 k w , t a = +25 c v cc = +15 v, v ee = 15 v, r l = 2.0 k w , t a = t low to t high v ol e e e 0.1 14.7 e 0.3 14.3 13.5 e e e 0.1 14.7 e 0.3 14.3 13.5 v output short circuit current (v id = 1.0 v, v o = 0 v, t a = 25 c) source sink i sc 10 20 30 30 e e 10 20 30 30 e e ma common mode rejection r s 10 k w , v cm = v icr , t a = 25 c cmr 80 97 e 70 97 e db power supply rejection (r s = 100 w ) v cc /v ee = +16.5 v/16.5 v to +13.5 v/13.5 v, t a = 25 c psr 80 97 e 70 97 e db power supply current (per amplifier, no load) v cc = +5.0 v, v ee = 0 v, v o = +2.5 v, t a = +25 c v cc = +15 v, v ee = 15 v, v o = 0 v, t a = +25 c v cc = +15 v, v ee = 15 v, v o = 0 v, t a = t low to t high i d e e e 1.6 1.9 e 2.0 2.5 2.8 e e e 1.6 1.9 e 2.0 2.5 2.8 ma notes: 3. t low = 40 c for mc33071, 2, 4, /a t high = +85 c for mc33071, 2, 4, /a =0 c for mc34071, 2, 4, /a = +70 c for mc34071, 2, 4, /a
mc34071,2,4,a mc33071,2,4,a 2275 motorola analog ic device data ac electrical characteristics (v cc = +15 v, v ee = 15 v, r l = connected to ground. t a = +25 c, unless otherwise noted.) a suffix nonsuffix characteristics symbol min typ max min typ max unit slew rate (v in = 10 v to +10 v, r l = 2.0 k w , c l = 500 pf) a v = +1.0 a v = 1.0 sr 8.0 e 10 13 e e 8.0 e 10 13 e e v/ m s setting time (10 v step, a v = 1.0) to 0.1% (+1/2 lsb of 9bits) to 0.01% (+1/2 lsb of 12bits) t s e e 1.1 2.2 e e e e 1.1 2.2 e e m s gain bandwidth product (f = 100 khz) gbw 3.5 4.5 e 3.5 4.5 e mhz power bandwidth a v = +1.0, r l = 2.0 k w , v o = 20 v pp , thd = 5.0% bw e 160 e e 160 e khz phase margin r l = 2.0 k w r l = 2.0 k w , c l = 300 pf f m e e 60 40 e e e e 60 40 e e deg gain margin r l = 2.0 k w r l = 2.0 k w , c l = 300 pf a m e e 12 4.0 e e e e 12 4.0 e e db equivalent input noise voltage r s = 100 w , f = 1.0 khz e n e 32 e e 32 e nv/ h z equivalent input noise current f = 1.0 khz i n e 0.22 e e 0.22 e pa/ h z differential input resistance v cm = 0 v r in e 150 e e 150 e m w differential input capacitance v cm = 0 v c in e 2.5 e e 2.5 e pf total harmonic distortion a v = +10, r l = 2.0 k w , 2.0 v pp v o 20 v pp , f = 10 khz thd e 0.02 e e 0.02 e % channel separation (f = 10 khz) e e 120 e e 120 e db open loop output impedance (f = 1.0 mhz) |z o | e 30 e e 30 e w figure 1. power supply configurations figure 2. offset null circuit single supply split supplies 1 2 3 4 v cc v ee v cc v cc v ee v ee 1 2 3 4 3.0 v to 44 v v cc +|v ee | 44 v offset nulling range is approximately 80 mv with a 10 k potentiometer (mc33071, mc34071 only). v cc v ee 1 2 3 4 5 6 7 10 k +
mc34071,2,4,a mc33071,2,4,a 2276 motorola analog ic device data r l connected to ground t a = 25 c r l = 10 k r l = 2.0 k v o , output voltage swing (v pp ) figure 3. maximum power dissipation versus temperature for package types figure 4. input offset voltage versus temperature for representative units figure 5. input common mode voltage range versus temperature figure 6. normalized input bias current versus temperature figure 7. normalized input bias current versus input common mode voltage figure 8. split supply output voltage swing versus supply voltage t a , ambient temperature ( c) d p , maximum power dissipation (mw) 55 40 20 0 20 40 60 80 100 120 140 160 8 & 14 pin plastic pkg so14 pkg so8 pkg t a , ambient temperature ( c) io v , input offset voltage (mv) 55 25 0 25 50 75 100 125 v cc = +15 v v ee = 15 v v cm = 0 t a , ambient temperature ( c) icr v , input common mode voltage range (v) 55 25 0 25 50 75 100 125 v cc v cc /v ee = +1.5 v/ 1.5 v to +22 v/ 22 v v ee t a , ambient temperature ( c) ib i , input bias current (normalized) 55 25 0 25 50 75 100 125 v cc = +15 v v ee = 15 v v cm = 0 v i c , input common mode voltage (v) 12 8.0 4.0 0 4.0 8.0 12 v cc = +15 v v ee = 15 v t a = 25 c v cc , |v ee |, supply voltage (v) 0 5.0 10 15 20 25 v ib i , input bias current (normalized) 2400 2000 1600 1200 800 400 0 4.0 2.0 0 2.0 4.0 v cc v cc 0.8 v cc 1.6 v cc 2.4 v ee +0.01 v ee 1.3 1.2 1.1 1.0 0.9 0.8 0.7 1.4 1.2 1.0 0.8 0.6 50 40 30 20 10 0
mc34071,2,4,a mc33071,2,4,a 2277 motorola analog ic device data v cc v cc = +15 v r l to v cc t a = 25 c gnd v cc v cc = +15 v r l = gnd t a = 25 c gnd v o , output voltage swing (v pp ) figure 9. single supply output saturation versus load resistance to v cc 60 figure 10. split supply output saturation versus load current figure 11. single supply output saturation versus load resistance to ground figure 12. output short circuit current versus temperature figure 13. output impedance versus frequency figure 14. output voltage swing versus frequency 0 5.0 10 15 20 i l, load current ( ma) v cc v ee sink v cc /v ee = +5.0 v/ 5.0 v to +22 v/ 22 v t a = 25 c source r l , load resistance to ground ( w ) 100 1.0 k 10 k 100 k sat v , output saturation voltage (v) r l , load resistance to v cc ( w ) 100 1.0 k 10 k 100 k t a , ambient temperature ( c) sc i , output current (ma) 55 25 0 25 50 75 100 125 v cc = +15 v v ee = 15 v r l 0.1 w d v in = 1.0 v sink source f, frequency (hz) o z , output impedance ( ) w 1.0 k 10 k 100 1.0 m 10 m a v = 1000 a v = 100 a v = 10 a v = 1.0 v cc = +15 v v ee = 15 v v cm = 0 v o = 0 d i o = 0.5 ma t a = 25 c f, frequency (hz) 3.0 k 10 k 30 k 100 k 300 k 1.0 m 3.0 m v cc = +15 v v ee = 15 v a v = +1.0 r l = 2.0 k thd 1.0% t a = 25 c sat v , output saturation voltage (v) sat v , output saturation voltage (v) v cc v cc 1.0 v cc 2.0 v ee +2.0 v ee +1.0 v ee v cc 2.0 v cc 4.0 v cc 0.2 0.1 0 0 0.4 0.8 2.0 1.0 50 40 30 20 10 0 50 40 30 20 10 0 28 24 20 16 12 8.0 4.0 0
mc34071,2,4,a mc33071,2,4,a 2278 motorola analog ic device data 1. phase r l = 2.0 k 2. phase r l = 2.0 k, c l = 300 pf 3. gain r l = 2.0 k 4. gain r l = 2.0 k, c l = 300 pf v cc = +15 v v ee = 15 v v o = 0 v t a = 25 c phase margin = 60 gain margin = 12 db 3 4 1 2 gain v cc = +15 v v ee = 15 v v o = 0 v r l = 2.0 k t a = 25 c phase phase margin = 60 figure 15. total harmonic distortion versus frequency figure 16. total harmonic distortion versus output voltage swing figure 17. open loop voltage gain versus temperature figure 18. open loop voltage gain and phase versus frequency figure 19. open loop voltage gain and phase versus frequency figure 20. normalized gain bandwidth product versus temperature f, frequency (hz) 10 100 1.0 k 10 k 100 k a v = 1000 a v = 100 a v = 10 a v = 1.0 v cc = +15 v v ee = 15 v v o = 2.0 v pp r l = 2.0 k t a = 25 c v o , output voltage swing (v pp ) thd, total harmonic distortion (%) 0 4.0 8.0 12 16 20 v cc = +15 v v ee = 15 v r l = 2.0 k t a = 25 c a v = 1000 a v = 100 a v = 10 a v = 1.0 t a , ambient temperature ( c) 55 25 0 25 50 75 100 125 v cc = +15 v v ee = 15 v v o = 10 v to +10 v r l = 10 k f 10hz f, frequency (hz) 1.0 10 100 1.0 k 10 k 100 k 1.0 m 10 m 100 m , excess phase (degrees) f , excess phase (degrees) f f, frequency (mhz) 1.0 2.0 3.0 5.0 7.0 10 20 30 t a , ambient temperature ( c) gbw, gain bandwidth product (normalied) 55 25 0 25 50 75 100 12 5 v cc = +15 v v ee = 15 v r l = 2.0 k vol a, ope n loop volt a ge g ain (d b ) 0.4 0.3 0.2 0.1 0 4.0 3.0 2.0 1.0 0 116 112 108 104 100 96 100 80 60 40 20 0 20 10 0 10 20 30 40 1.15 1.1 1.05 1.0 0.95 0.9 0.85 0 45 90 135 180 100 120 140 160 180 t hd, tot a l ha r m o ni c dis tort i o n ( % ) vol a, ope n loop volt a ge g ain (d b ) vol a , open loop voltage gain (db)
mc34071,2,4,a mc33071,2,4,a 2279 motorola analog ic device data v cc = +15 v v ee = 15 v a v = +1.0 r l = 2.0 k to v o = 10 v to +10 v t a = 25 c figure 21. percent overshoot versus load capacitance figure 22. phase margin versus load capacitance figure 23. gain margin versus load capacitance figure 24. phase margin versus temperature figure 25. gain margin versus temperature figure 26. phase margin and gain margin versus differential source resistance percent overshoot c l , load capacitance (pf) 10 100 1.0 k 10 k v cc = +15 v v ee = 15 v r l = 2.0 k v o = 10 v to +10 v t a = 25 c c l , load capacitance (pf) , phase margin (degrees) f m 10 100 1.0 k 10 k v cc = +15 v v ee = 15 v a v = +1.0 r l = 2.0 k to v o = 10 v to +10 v t a = 25 c c l , load capacitance (pf) m a , gain margin (db) 10 100 1.0 k 10 k , phase margin (degrees) f m t a , ambient temperature ( c) 55 25 0 25 50 75 100 125 v cc = +15 v v ee = 15 v a v = +1.0 r l = 2.0 k to v o = 10 v to +10 v c l = 10 pf c l = 100 pf c l = 1,000 pf c l = 10,000 pf t a , ambient temperature ( c) 55 25 0 25 50 75 100 125 v cc = +15 v v ee = 15 v a v = +1.0 r l = 2.0 k to v o = 10 v to +10 v c l = 10 pf c l = 1,000 pf m a , gain margin (db) c l = 100 pf c l = 10,000 pf phase m a , gain margin (db) r t , differential source resistance ( w ) 1.0 100 1.0 k 10 k 10 100 k r 1 r 2 v o + v cc = +15 v v ee = 15 v r t = r 1 + r 2 a v = +100 v o = 0 v t a = 25 c gain , phase margin (degrees) f m 100 80 60 40 20 0 70 60 50 40 30 20 10 0 14 12 10 8.0 6.0 2.0 0 4.0 80 60 40 20 0 16 12 8.0 4.0 0 12 10 8.0 6.0 4.0 2.0 0 60 50 40 30 20 10 0 70
mc34071,2,4,a mc33071,2,4,a 2280 motorola analog ic device data figure 27. normalized slew rate versus temperature figure 28. output settling time figure 29. small signal transient response figure 30. large signal transient reponse figure 31. common mode rejection versus frequency figure 32. power supply rejection versus frequency t a , ambient temperature ( c) s r , s le w r a te ( n or ma l iz e d ) 55 25 0 25 50 75 100 125 v cc = +15 v v ee = 15 v a v = +1.0 r l = 2.0 k c l = 500 pf t s , settling time ( m s) o v , output voltage swing from 0 v (v) d 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 v cc = +15 v v ee = 15 v a v = 1.0 t a = 25 c 10 mv 1.0 mv 1.0 mv compensated uncompensated 10 mv 1.0 mv 1.0 mv 50 mv/div 2.0 m s/div v cc = +15 v v ee = 15 v a v = +1.0 r l = 2.0 k c l = 300 pf t a = 25 c 5.0 v/div 1.0 m s/div f, frequency (hz) c m r , co mm o n m o d e reject i o n (d b ) 0.1 1.0 10 100 1.0 k 10 k 100 k 1.0 m 10 m t a = 25 c t a = 125 c t a = 55 c v cc = +15 v v ee = 15 v v cm = 0 v d v cm = 1.5 v f, frequency (hz) psr, power supply rejection (db) 0.1 1.0 10 100 1.0 k 10 k 100 k 1.0 m 10 m v cc = +15 v v ee = 15 v t a = 25 c ( d v cc = +1.5 v) ( d v ee = +1.5 v) +psr psr v cc = +15 v v ee = 15 v a v = +1.0 r l = 2.0 k c l = 300 pf t a = 25 c 1.15 1.1 1.05 1.0 0.95 0.9 0.85 10 5.0 0 5.0 10 0 0 100 80 60 40 20 0 100 80 60 40 20 0 d v cm d v o a dm cmr = 20 log d v cm d v o x a dm + d v o a dm + d v cc d v ee d v o /a dm d v cc +psr = 20 log d v o /a dm d v ee psr = 20 log
mc34071,2,4,a mc33071,2,4,a 2281 motorola analog ic device data figure 33. supply current versus supply voltage figure 34. power supply rejection versus temperature figure 35. channel separation versus frequency figure 36. input noise versus frequency v cc , |v ee |, supply voltage (v) cc i , supply current (ma) 0 5.0 10 15 20 25 t a = 25 c t a = 125 c t a = 55 c t a , ambient temperature ( c) psr, power supply rejection (db) 55 25 0 25 50 75 100 125 v cc = +15 v v ee = 15 v ( d v cc = +1.5 v) ( d v ee = +1.5 v) +psr psr f, frequency (khz) channel separation (db) 10 20 30 50 70 100 200 300 v cc = +15 v v ee = 15 v t a = 25 c f, frequency (khz) n e , input noice voltage ( i , input noise current (pa ) 10 100 1.0 k 10 k 100 k nv hz ) hz n voltage current 9.0 8.0 7.0 6.0 5.0 4.0 105 95 85 75 65 120 100 80 60 40 20 0 70 60 50 40 30 20 10 0 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0 d v o a dm + d v cc d v ee d v o /a dm d v cc +psr = 20 log d v o /a dm d v ee psr = 20 log v cc = +15 v v ee = 15 v v cm = 0 t a = 25 c applications information circuit description/performance features although the bandwidth, slew rate, and settling time of the mc34071 amplifier series are similar to op amp products utilizing jfet input devices, these amplifiers offer other additional distinct advantages as a result of the pnp transistor differential input stage and an all npn transistor output stage. since the input common mode voltage range of this input stage includes the v ee potential, single supply operation is feasible to as low as 3.0 v with the common mode input voltage at ground potential. the input stage also allows differential input voltages up to 44 v, provided the maximum input voltage range is not exceeded. specifically, the input voltages must range between v ee and v cc supply voltages as shown by the maximum rating table. in practice, although not recommended, the input voltages can exceed the v cc voltage by approximately 3.0 v and decrease below the v ee voltage by 0.3 v without causing product damage, although output phase reversal may occur. it is also possible to source up to approximately 5.0 ma of current from v ee through either inputs clamping diode without damage or latching, although phase reversal may again occur. if one or both inputs exceed the upper common mode voltage limit, the amplifier output is readily predictable and may be in a low or high state depending on the existing input bias conditions.
mc34071,2,4,a mc33071,2,4,a 2282 motorola analog ic device data since the input capacitance associated with the small geometry input device is substantially lower (2.5 pf) than the typical jfet input gate capacitance (5.0 pf), better frequency response for a given input source resistance can be achieved using the mc34071 series of amplifiers. this performance feature becomes evident, for example, in fast settling dtoa current to voltage conversion applications where the feedback resistance can form an input pole with the input capacitance of the op amp. this input pole creates a 2nd order system with the single pole op amp and is therefore detrimental to its settling time. in this context, lower input capacitance is desirable especially for higher values of feedback resistances (lower current dacs). this input pole can be compensated for by creating a feedback zero with a capacitance across the feedback resistance, if necessary, to reduce overshoot. for 2.0 k w of feedback resistance, the mc34071 series can settle to within 1/2 lsb of 8 bits in 1.0 m s, and within 1/2 lsb of 12bits in 2.2 m s for a 10 v step. in a inverting unity gain fast settling configuration, the symmetrical slew rate is 13 v/ m s. in the classic noninverting unity gain configuration, the output positive slew rate is +10 v/ m s, and the corresponding negative slew rate will exceed the positive slew rate as a function of the fall time of the input waveform. since the bipolar input device matching characteristics are superior to that of jfets, a low untrimmed maximum offset voltage of 3.0 mv prime and 5.0 mv downgrade can be economically offered with high frequency performance characteristics. this combination is ideal for low cost precision, high speed quad op amp applications. the all npn output stage, shown in its basic form on the equivalent circuit schematic, offers unique advantages over the more conventional npn/pnp transistor class ab output stage. a 10 k w load resistance can swing within 1.0 v of the positive rail (v cc ), and within 0.3 v of the negative rail (v ee ), providing a 28.7 v pp swing from 15 v supplies. this large output swing becomes most noticeable at lower supply voltages. the positive swing is limited by the saturation voltage of the current source transistor q 7 , and v be of the npn pull up transistor q 17 , and the voltage drop associated with the short circuit resistance, r 7 . the negative swing is limited by the saturation voltage of the pulldown transistor q 16 , the voltage drop i l r 6 , and the voltage drop associated with resistance r 7 , where i l is the sink load current. for small valued sink currents, the above voltage drops are negligible, allowing the negative swing voltage to approach within millivolts of v ee . for large valued sink currents (>5.0 ma), diode d3 clamps the voltage across r 6 , thus limiting the negative swing to the saturation voltage of q 16 , plus the forward diode drop of d3 ( v ee +1.0 v). thus for a given supply voltage, unprecedented peaktopeak output voltage swing is possible as indicated by the output swing specifications. if the load resistance is referenced to v cc instead of ground for single supply applications, the maximum possible output swing can be achieved for a given supply voltage. for light load currents, the load resistance will pull the output to v cc during the positive swing and the output will pull the load resistance near ground during the negative swing. the load resistance value should be much less than that of the feedback resistance to maximize pull up capability. because the pnp output emitterfollower transistor has been eliminated, the mc34071 series offers a 20 ma minimum current sink capability, typically to an output voltage of (v ee +1.8 v). in single supply applications the output can directly source or sink base current from a common emitter npn transistor for fast high current switching applications. in addition, the all npn transistor output stage is inherently fast, contributing to the bipolar amplifier's high gain bandwidth product and fast settling capability. the associated high frequency low output impedance (30 w typ @ 1.0 mhz) allows capacitive drive capability from 0 pf to 10,000 pf without oscillation in the unity closed loop gain configuration. the 60 phase margin and 12 db gain margin as well as the general gain and phase characteristics are virtually independent of the source/sink output swing conditions. this allows easier system phase compensation, since output swing will not be a phase consideration. the high frequency characteristics of the mc34071 series also allow excellent high frequency active filter capability, especially for low voltage single supply applications. although the single supply specifications is defined at 5.0 v, these amplifiers are functional to 3.0 v @ 25 c although slight changes in parametrics such as bandwidth, slew rate, and dc gain may occur. if power to this integrated circuit is applied in reverse polarity or if the ic is installed backwards in a socket, large unlimited current surges will occur through the device that may result in device destruction. special static precautions are not necessary for these bipolar amplifiers since there are no mos transistors on the die. as with most high frequency amplifiers, proper lead dress, component placement, and pc board layout should be exercised for optimum frequency performance. for example, long unshielded input or output leads may result in unwanted inputoutput coupling. in order to preserve the relatively low input capacitance associated with these amplifiers, resistors connected to the inputs should be immediately adjacent to the input pin to minimize additional stray input capacitance. this not only minimizes the input pole for optimum frequency response, but also minimizes extraneous apick upo at this node. supply decoupling with adequate capacitance immediately adjacent to the supply pin is also important, particularly over temperature, since many types of decoupling capacitors exhibit great impedance changes over temperature. the output of any one amplifier is current limited and thus protected from a direct short to ground. however, under such conditions, it is important not to allow the device to exceed the maximum junction temperature rating. typically for 15 v supplies, any one output can be shorted continuously to ground without exceeding the maximum temperature rating.
mc34071,2,4,a mc33071,2,4,a 2283 motorola analog ic device data figure 37. ac coupled noninverting amplifer figure 38. ac coupled inverting amplifier (typical single supply applications v cc = 5.0 v) figure 39. dc coupled inverting amplifer maximum output swing figure 40. unity gain buffer ttl driver figure 41. active highq notch filter figure 42. active bandpass filter + v cc 5.1 m 20 k c in v in 1.0 m mc34071 v o 0 3.7 v pp r l 10 k a v = 101 100 k 1.0 k bw (3.0 db) = 45 khz c o v o 36.6 mv pp + 3.7 v pp 0 v cc v o 100 k c in 10 k 100 k c o r l 10 k 68 k v in 370 mv pp a v = 10 bw (3.0 db) = 450 khz + 4.75 v pp v o v o v cc r l 100 k 91 k 5.1 k 1.0 m a v = 10 v in 2.63 v 5.1 k bw (3.0 db) = 450 khz + v in 2.5 v 0 0 to 10,000 pf cable ttl gate + v in v o 16 k c 0.01 32 k 2.0 r 2.0 c 0.02 f o = 1.0 khz f o = v in 0.2 vdc 1 4 p rc 2.0 c 0.02 16 k r r + v in v o v cc r3 2.2 k c 0.047 r2 5.6 k 0.4 v cc r1 f o = 30 khz h o = 10 h o = 1.0 1.1 k given f o = center frequency a o = gain at center frequency choose value f o , q, a o , c r3 = r1 = r2 = q r3 r1 r3 2h o 4q 2 r1r3 p f o c for less than 10% error from operational amplifier q o f o gbw < 0.1 where f o and gbw are expressed in hz. c 0.047 mc34071 mc34071 mc34071 mc34071 mc34071 mc54/74xx then: gbw = 4.5 mhz typ.
mc34071,2,4,a mc33071,2,4,a 2284 motorola analog ic device data figure 43. low voltage fast d/a converter figure 44. high speed low voltage comparator figure 45. led driver figure 46. transistor driver figure 47. ac/dc ground current monitor figure 48. photovoltaic cell amplifier 5.0 k 10 k bit switches c f r f v o v cc (r2r) ladder network settling time 1.0 m s (8bits, 1/2 lsb) + 5.0 k 5.0 k 10 k 10 k + v o v o v in 1.0 v 2.0 k r l 2.0 v 4.0 v 0.1 t 25 v/ m s 0.2 m s delay delay 1.0 m s v in t 13 v/ m s + v cc v ref aono v in < v ref aono v in > v ref v in + v cc v cc r l r l (a) pnp (b) npn + + v o i load r1 r2 r s ground current sense resistor v o = i load r s bw ( 3.0 db) = gbw for v o > 0.1v r1 r2 r1+r2 r2 + v o mc34071 i cell v cell = 0 v v o = i cell r f v o > 0.1 v r f 1+ mc34071 mc34071 mc34071 mc34071 mc34071 mc34071
mc34071,2,4,a mc33071,2,4,a 2285 motorola analog ic device data figure 49. low input voltage comparator with hysteresis figure 50. high compliance voltage to sink current converter figure 51. high input impedance differential amplifier figure 52. bridge current amplifier figure 53. low voltage peak detector figure 54. high frequency pulse width modulation v ref r2 v o v oh v ol v inl v inh v ref hysteresis v in v in r1 mc34071 v inl =(v ol v ref )+v ref r1 r1+r2 v inh =(v oh v ref )+v ref v h =(v oh v ol ) + r1 r1+r r1 r1+r2 v in i out r + i out = v in v io r 1/2 mc34072 + + r1 r2 r3 r4 v o +v1 +v2 r2 r4 r3 r1 (critical to cmrr) v o = 1 v2v1 for (v2 v1), v > 0 = + r4 r3 r4 r3 + +v ref r f v o rr r r = d r d r < < r r f > > r (v o 0.1 v) r f v o = v ref d r r f 2r 2 + v in v in r l v p 10,000 pf v o = v in (pk) + v p t + + v p t t i out v p + 0 + i sc base charge removal i b v+ 47 k 100 k c r pulse width control group osc comparator high current output f osc v 0.85 rc 100 k i b mc34071 mc34071 mc34071 1/2 mc34072 1/2 mc34072 1/2 mc34072
mc34071,2,4,a mc33071,2,4,a 2286 motorola analog ic device data figure 55. second order lowpass active filter figure 56. second order highpass active filter general additional applications information v s = 15.0 v figure 57. fast settling inverter figure 58. basic inverting amplifier figure 59. basic noninverting amplifier figure 60. unity gain buffer (a v = +1.0) + r1 r3 560 510 c2 c1 0.44 0.02 r2 5.6 k mc34071 f o = 1.0 khz h o = 10 choose: f o , h o , c2 then: c1 = 2c2 (h o +1) r2 = r3 = r1 = r2 h o h o +1 4 p f o c2 r2 + c2 0.05 c1 1.0 r1 46.1 k r2 1.1 k f o = 100 hz h o = 20 choose: f o , h o , c1 then: r1 = r2 = c2 = h o +0.5 p f o c1 2 p f o c1 (1/h o +2) c h o c1 1.0 + c f * v o = 10 v step r f 2.0 k i high speed dac *optional compensation uncompensated compensated t s = 1.0 m s to 1/2 lsb (8bits) t s = 2.2 m s to 1/2 lsb (12bits) sr = 13 v/ m s v o + r1 r2 v o v in r l bw (3.0 db) = gbw = sr = 13 v/ m s v o v in r2 r1 r1 +r2 r1 bw (3.0 db) = gbw r1 +r2 r1 + v in v o r2 r l r1 = v o v in r2 r1 1 + + v in v o bw p = 200 khz v o = 20 v pp sr = 10 v/ m s mc34071 mc34071 mc34071 mc34071 mc34071 2 2 2
mc34071,2,4,a mc33071,2,4,a 2287 motorola analog ic device data figure 61. high impedance differential amplifier figure 62. dual voltage doubler r r e example: let: r = r e = 12 k then: a v = 3.0 bw = 1.5 mhz a v = 1 + 2 r r e + + + v o r r r r r mc34074 + + 100 k 10 +10 10 220 pf v o +v o r l +v o v o 18.93 18.78 10 k 18 18 5.0 k 15.4 15.4 r l 100 k 100 k r l + + + + + 10 10 10 mc34074 mc34074 mc34074 mc34074 mc34074
121 motorola analog ic device data tape and reel options in brief . . . page tape and reel configurations 122 . . . . . . . . . . . . . . . . . . . . . tape and reel information table 124 . . . . . . . . . . . . . . . . . . . analog mpq table 125 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . motorola offers the convenience of tape and reel packaging for our growing family of standard integrated circuit products. reels are available to support the requirements of both first and second generation pickandplace equipment. the packaging fully conforms to the latest eia481a specification. the antistatic embossed tape provides a secure cavity, sealed with a peelback cover tape.
122 motorola analog ic device data tape and reel configurations typical user direction of feed soic and micro8 devices pin 1 typical user direction of feed plcc devices typical user direction of feed dpak and d 2 pak devices mechanical polarization typical user direction of feed sot23 (5 pin) devices typical sot89 (3 pin) devices user direction of feed typical sot89 (5 pin) devices user direction of feed
123 motorola analog ic device data tape and reel configurations (continued) style a (preferred) to92 reel styles carrier strip adhesive tape rounded side feed rounded side of transistor and adhesive tape visible. flat side of transistor and adhesive tape visible. feed adhesive tape on top side carrier strip adhesive tape on top side style m ammo pack is equivalent to style e of reel pack dependent on feed orientation from box. flat side label style m style p (preferred) rounded side style p ammo pack is equivalent to styles a and b of reel pack dependent on feed orientation from box. flat side of transistor and adhesive tape visible. rounded side of transistor and adhesive tape visible. to92 ammo pack styles carrier strip adhesive tape flat side label carrier strip style e feed feed h2a h2a h f1 f2 p2 p2 p1 p d w w1 l1 w2 h2b h2b t1 t t2 h4 h5 h1 l to92 eia radial tape in fan fold box or on reel
124 motorola analog ic device data tape and reel information table tape width devices (1) reel size device package p (mm) per reel (inch) suffix so8, sop8 12 2,500 13 r2 so14 16 2,500 13 r2 so16 16 2,500 13 r2 so16l, so8+8l wide 16 1,000 13 r2 so20l wide 24 1,000 13 r2 so24l wide 24 1,000 13 r2 so28l wide 24 1,000 13 r2 so28l wide 32 1,000 13 r3 micro8 12 2,500 13 r2 plcc20 16 1,000 13 r2 plcc28 24 500 13 r2 plcc44 32 500 13 r2 plcc52 32 500 13 r2 plcc68 44 250 13 r2 plcc84 44 250 13 r2 to226aa (to92) (2) 18 2,000 13 ra, re, rp, or rm (ammo pack) only dpak 16 2,500 13 rk d 2 pak 24 800 13 r4 sot23 (5 pin) 8 3,000 7 tr sot89 (3/5 pin) 12 1,000 7 t1 (1) minimum order quantity is 1 reel. distributors/oem customers may break lots or reels at their option, however broken reels may not be returned. (2) integrated circuits in to226aa packages are available in styes a and e only, with optional aammo packo (suffix rp or rm). the ra and rp configurations are preferred. for ordering information please contact your local motorola semiconductor sales office.
125 motorola analog ic device data analog mpq table tape/reel and ammo pack package type package code mpq package type package code mpq plcc case 775 0802 1000/reel case 776 0804 500/reel case 777 0801 500/reel soic case 751 0095 2500/reel case 751a 0096 2500/reel case 751b 0097 2500/reel case 751g 2003 1000/reel case 751d 2005 1000/reel case 751e 2008 1000/reel case 751f 2009 1000/reel micro8 case 846a 2500/reel to92 case 29 0031 2000/reel case 29 0031 2000/ammo pack dpak case 369a 2500/reel d 2 pak case 936 800/reel sot23 (5 pin) case 1212 3000/reel sot89 (3 pin) case 1213 1000/reel sot89 (5 pin) case 1214 1000/reel
126 motorola analog ic device data
131 motorola analog ic device data packaging information in brief . . . the packaging availability for each device type is indicated on the individual data sheets and the selector guide. all of the outline dimensions for the packages are given in this section. the maximum power consumption an integrated circuit can tolerate at a given operating ambient temperature can be found from the equation: t j(max) t a r q ja(typ) p d(ta) = where: p d(ta) = power dissipation allowable at a given operating ambient temperature. this must be greater than the sum of the products of the supply voltages and supply currents at the worst case operating condition. t j(max) = maximum operating junction temperature as listed in the maximum ratings section. see individual data sheets for t j(max) information. t a = maximum desired operating ambient temperature r q ja(typ) = typical thermal resistance junction-to- ambient
132 motorola analog ic device data case outline dimensions lp, p, z suffix case 29-04 plastic package (to-226aa/to-92) issue ad kc, t suffix case 221a-06 plastic package issue y notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. contour of package beyond dimension r is uncontrolled. 4. dimension f applies between p and l. dimension d and j apply between l and k minimum. lead dimension is uncontrolled in p and beyond dimension k minimum. dim min max min max millimeters inches a 0.175 0.205 4.45 5.20 b 0.170 0.210 4.32 5.33 c 0.125 0.165 3.18 4.19 d 0.016 0.022 0.41 0.55 f 0.016 0.019 0.41 0.48 g 0.045 0.055 1.15 1.39 h 0.095 0.105 2.42 2.66 j 0.015 0.020 0.39 0.50 k 0.500 12.70 l 0.250 6.35 n 0.080 0.105 2.04 2.66 p 0.100 2.54 r 0.115 2.93 v 0.135 3.43 r a p j l f b k g h section xx c v d n n xx seating plane 1 1 2 3 1 2 3 4 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. a k l g d n h q f 123 4 t seating plane s r j u t c 3 pl b y m b m 0.25 (0.010) y dim min max min max millimeters inches a 0.560 0.625 14.23 15.87 b 0.380 0.420 9.66 10.66 c 0.140 0.190 3.56 4.82 d 0.020 0.045 0.51 1.14 f 0.139 0.155 3.53 3.93 g 0.100 bsc 2.54 bsc h 0.280 7.11 j 0.012 0.045 0.31 1.14 k 0.500 0.580 12.70 14.73 l 0.045 0.070 1.15 1.77 n 0.200 bsc 5.08 bsc q 0.100 0.135 2.54 3.42 r 0.080 0.115 2.04 2.92 s 0.020 0.055 0.51 1.39 t 0.235 0.255 5.97 6.47 u 0.000 0.050 0.00 1.27
133 motorola analog ic device data t suffix case 314c01 plastic package issue a th suffix case 314a-03 plastic package issue d t, tv suffix case 314b-05 plastic package issue j 1 5 1 5 1 5 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 0.043 (1.092) maximum. dim a min max min max millimeters 0.572 0.613 14.529 15.570 inches b 0.390 0.415 9.906 10.541 c 0.170 0.180 4.318 4.572 d 0.025 0.038 0.635 0.965 e 0.048 0.055 1.219 1.397 f 0.570 0.585 14.478 14.859 g 0.067 bsc 1.702 bsc j 0.015 0.025 0.381 0.635 k 0.730 0.745 18.542 18.923 l 0.320 0.365 8.128 9.271 q 0.140 0.153 3.556 3.886 s 0.210 0.260 5.334 6.604 u 0.468 0.505 11.888 12.827 t seating plane l s e c f k j optional chamfer 5x d 5x m p m 0.014 (0.356) t g a u b q p notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 10.92 (0.043) maximum. a k b q 5 pl d g j c m q m 0.356 (0.014) t l e t seating plane 12345 dim min max min max millimeters inches a 0.610 0.625 15.59 15.88 b 0.380 0.420 9.65 10.67 c 0.160 0.190 4.06 4.83 d 0.020 0.040 0.51 1.02 e 0.035 0.055 0.89 1.40 g 0.067 bsc 1.702 bsc j 0.015 0.025 0.38 0.64 k 0.500 12.70 l 0.355 0.370 9.02 9.40 q 0.139 0.147 3.53 3.73 v q k f u a b g p m 0.10 (0.254) p m t 5x j m 0.24 (0.610) t optional chamfer s l w e c h n t seating plane notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 0.043 (1.092) maximum. dim min max min max millimeters inches a 0.572 0.613 14.529 15.570 b 0.390 0.415 9.906 10.541 c 0.170 0.180 4.318 4.572 d 0.025 0.038 0.635 0.965 e 0.048 0.055 1.219 1.397 f 0.850 0.935 21.590 23.749 g 0.067 bsc 1.702 bsc h 0.166 bsc 4.216 bsc j 0.015 0.025 0.381 0.635 k 0.900 1.100 22.860 27.940 l 0.320 0.365 8.128 9.271 n 0.320 bsc 8.128 bsc q 0.140 0.153 3.556 3.886 s 0.620 15.748 u 0.468 0.505 11.888 12.827 v 0.735 18.669 w 0.090 0.110 2.286 2.794 5x d
134 motorola analog ic device data dt-1 suffix case 369-07 plastic package (dpak) issue k t, t1 suffix case 314d-03 plastic package issue d 2 3 4 1 2 3 1 4 5 dt suffix case 369a-13 plastic package (dpak) issue y 4 3 1 d a k b r v s f l g 2 pl m 0.13 (0.005) t e c u j h t seating plane z dim min max min max millimeters inches a 0.235 0.250 5.97 6.35 b 0.250 0.265 6.35 6.73 c 0.086 0.094 2.19 2.38 d 0.027 0.035 0.69 0.88 e 0.033 0.040 0.84 1.01 f 0.037 0.047 0.94 1.19 g 0.180 bsc 4.58 bsc h 0.034 0.040 0.87 1.01 j 0.018 0.023 0.46 0.58 k 0.102 0.114 2.60 2.89 l 0.090 bsc 2.29 bsc r 0.175 0.215 4.45 5.46 s 0.020 0.050 0.51 1.27 u 0.020 0.51 v 0.030 0.050 0.77 1.27 z 0.138 3.51 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 123 4 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 123 4 v s a k t seating plane r b f g d 3 pl m 0.13 (0.005) t c e j h dim min max min max millimeters inches a 0.235 0.250 5.97 6.35 b 0.250 0.265 6.35 6.73 c 0.086 0.094 2.19 2.38 d 0.027 0.035 0.69 0.88 e 0.033 0.040 0.84 1.01 f 0.037 0.047 0.94 1.19 g 0.090 bsc 2.29 bsc h 0.034 0.040 0.87 1.01 j 0.018 0.023 0.46 0.58 k 0.350 0.380 8.89 9.65 r 0.175 0.215 4.45 5.46 s 0.050 0.090 1.27 2.28 v 0.030 0.050 0.77 1.27 q 12345 u k d g s a b 5 pl j h l e c m q m 0.356 (0.014) t seating plane t dim min max min max millimeters inches a 0.572 0.613 14.529 15.570 b 0.390 0.415 9.906 10.541 c 0.170 0.180 4.318 4.572 d 0.025 0.038 0.635 0.965 e 0.048 0.055 1.219 1.397 g 0.067 bsc 1.702 bsc h 0.087 0.112 2.210 2.845 j 0.015 0.025 0.381 0.635 k 1.020 1.065 25.908 27.051 l 0.320 0.365 8.128 9.271 q 0.140 0.153 3.556 3.886 u 0.105 0.117 2.667 2.972 s 0.543 0.582 13.792 14.783 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 10.92 (0.043) maximum.
135 motorola analog ic device data dp1, n, p, p1 suffix case 626-05 plastic package issue k n, p, n-14, p2 suffix case 646-06 plastic package issue l 14 1 dp2, n, p, pc suffix case 648-08 plastic package issue r 16 1 8 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. rounded corners optional. a b f c s h g d j l m 16 pl seating 18 9 16 k plane t m a m 0.25 (0.010) t dim min max min max millimeters inches a 0.740 0.770 18.80 19.55 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.040 0.70 1.02 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.110 0.130 2.80 3.30 l 0.295 0.305 7.50 7.74 m 0 10 0 10 s 0.020 0.040 0.51 1.01 notes: 1. leads within 0.13 (0.005) radius of true position at seating plane at maximum material condition. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 4. rounded corners optional. 17 14 8 b a f hg d k c n l j m seating plane dim min max min max millimeters inches a 0.715 0.770 18.16 19.56 b 0.240 0.260 6.10 6.60 c 0.145 0.185 3.69 4.69 d 0.015 0.021 0.38 0.53 f 0.040 0.070 1.02 1.78 g 0.100 bsc 2.54 bsc h 0.052 0.095 1.32 2.41 j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.300 bsc 7.62 bsc m 0 10 0 10 n 0.015 0.039 0.39 1.01 notes: 1. dimension l to center of lead when formed parallel. 2. package contour optional (round or square corners). 3. dimensioning and tolerancing per ansi y14.5m, 1982. 14 5 8 f note 2 a b t seating plane h j g d k n c l m m a m 0.13 (0.005) b m t dim min max min max inches millimeters a 9.40 10.16 0.370 0.400 b 6.10 6.60 0.240 0.260 c 3.94 4.45 0.155 0.175 d 0.38 0.51 0.015 0.020 f 1.02 1.78 0.040 0.070 g 2.54 bsc 0.100 bsc h 0.76 1.27 0.030 0.050 j 0.20 0.30 0.008 0.012 k 2.92 3.43 0.115 0.135 l 7.62 bsc 0.300 bsc m 10 10 n 0.76 1.01 0.030 0.040
136 motorola analog ic device data b, p, p2, v suffix case 648c-03 plastic package (dip16) issue c 16 1 p suffix case 648e01 plastic package (dip16) issue o p suffix case 649-03 plastic package issue d 24 1 notes: 1. leads within 0.13 (0.005) radius of true position at seating plane at maximum material condition. 2. dimension l to center of leads when formed parallel. seating plane 1 12 24 13 j g f c k b h n q p a d m l dim min max min max inches millimeters a 31.50 32.13 1.240 1.265 b 13.21 13.72 0.520 0.540 c 4.70 5.21 0.185 0.205 d 0.38 0.51 0.015 0.020 f 1.02 1.52 0.040 0.060 g 2.54 bsc 0.100 bsc h 1.65 2.16 0.065 0.085 j 0.20 0.30 0.008 0.012 k 2.92 3.43 0.115 0.135 l 14.99 15.49 0.590 0.610 m 10 10 n 0.51 1.02 0.020 0.040 p 0.13 0.38 0.005 0.015 q 0.51 0.76 0.020 0.030 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension a and b does not include mold protrusion. 5. mold flash or protrusions shall not exceed 0.25 (0.010). 6. rounded corner optional. a b 16 9 18 d g h s c 13 pl s b m 0.25 (0.010) t t seating plane j m l r p f k s a dim min max min max millimeters inches a 0.740 0.760 18.80 19.30 b 0.245 0.260 6.23 6.60 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.050 0.070 1.27 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.120 0.140 3.05 3.55 l 0.295 0.305 7.50 7.74 m 0 10 0 10 p 0.200 bsc 5.08 bsc r 0.300 bsc 7.62 bsc s 0.015 0.035 0.39 0.88 dim min max min max millimeters inches a 0.740 0.840 18.80 21.34 b 0.240 0.260 6.10 6.60 c 0.145 0.185 3.69 4.69 d 0.015 0.021 0.38 0.53 e 0.050 bsc 1.27 bsc f 0.040 0.70 1.02 1.78 g 0.100 bsc 2.54 bsc j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.300 bsc 7.62 bsc m 0 10 0 10 n 0.015 0.040 0.39 1.01 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. internal lead connection between 4 and 5, 12 and 13. a b 16 9 18 f d g e n k c note 5 16 pl s a m 0.13 (0.005) t t seating plane s b m 0.13 (0.005) t j 16 pl m l 1 16
137 motorola analog ic device data a, b, n, p suffix case 707-02 plastic package issue c 18 1 p suffix case 710-02 plastic package issue b 28 1 notes: 1. positional tolerance of leads (d), shall be within 0.25 (0.010) at maximum material condition, in relation to seating plane and each other. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 1 seating plane 15 14 28 m a b k c n f g d h j l dim min max min max inches millimeters a 36.45 37.21 1.435 1.465 b 13.72 14.22 0.540 0.560 c 3.94 5.08 0.155 0.200 d 0.36 0.56 0.014 0.022 f 1.02 1.52 0.040 0.060 g 2.54 bsc 0.100 bsc h 1.65 2.16 0.065 0.085 j 0.20 0.38 0.008 0.015 k 2.92 3.43 0.115 0.135 l 15.24 bsc 0.600 bsc m 0 15 0 15 n 0.51 1.02 0.020 0.040 notes: 1. positional tolerance of leads (d), shall be within 0.25 (0.010) at maximum material condition, in relation to seating plane and each other. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 1 seating plane 10 9 18 m a b k c n f g d h j l dim min max min max inches millimeters a 22.22 23.24 0.875 0.915 b 6.10 6.60 0.240 0.260 c 3.56 4.57 0.140 0.180 d 0.36 0.56 0.014 0.022 f 1.27 1.78 0.050 0.070 g 2.54 bsc 0.100 bsc h 1.02 1.52 0.040 0.060 j 0.20 0.30 0.008 0.012 k 2.92 3.43 0.115 0.135 l 7.62 bsc 0.300 bsc m 0 15 0 15 n 0.51 1.02 0.020 0.040 p suffix case 711-03 plastic package issue c 40 1 notes: 1. positional tolerance of leads (d), shall be within 0.25 (0.010) at maximum material condition, in relation to seating plane and each other. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 120 40 21 b a c seating plane d f g h k n m j l dim min max min max inches millimeters a 51.69 52.45 2.035 2.065 b 13.72 14.22 0.540 0.560 c 3.94 5.08 0.155 0.200 d 0.36 0.56 0.014 0.022 f 1.02 1.52 0.040 0.060 g 2.54 bsc 0.100 bsc h 1.65 2.16 0.065 0.085 j 0.20 0.38 0.008 0.015 k 2.92 3.43 0.115 0.135 l 15.24 bsc 0.600 bsc m 0 15 0 15 n 0.51 1.02 0.020 0.040
138 motorola analog ic device data d, d1, d2 suffix case 751-05 plastic package (so-8, sop-8) issue r h, p, dp suffix case 738-03 plastic package issue e f, p, p-3 suffix case 724-03 plastic package (ndip24) issue d 24 1 notes: 1. chamfered contour optional. 2. dimension l to center of leads when formed parallel. 3. dimensioning and tolerancing per ansi y14.5m, 1982. 4. controlling dimension: inch. a b 24 13 12 1 t seating plane 24 pl k e f n c d g m a m 0.25 (0.010) t 24 pl j m b m 0.25 (0.010) t l m note 1 dim min max min max millimeters inches a 1.230 1.265 31.25 32.13 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.020 0.38 0.51 e 0.050 bsc 1.27 bsc f 0.040 0.060 1.02 1.52 g 0.100 bsc 2.54 bsc j 0.007 0.012 0.18 0.30 k 0.110 0.140 2.80 3.55 l 0.300 bsc 7.62 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.01 20 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimension b does not include mold flash. m l j 20 pl m b m 0.25 (0.010) t dim min max min max millimeters inches a 25.66 27.17 1.010 1.070 b 6.10 6.60 0.240 0.260 c 3.81 4.57 0.150 0.180 d 0.39 0.55 0.015 0.022 g 2.54 bsc 0.100 bsc j 0.21 0.38 0.008 0.015 k 2.80 3.55 0.110 0.140 l 7.62 bsc 0.300 bsc m 0 15 0 15 n 0.51 1.01 0.020 0.040 e 1.27 1.77 0.050 0.070 1 11 10 20 a seating plane k n f g d 20 pl t m a m 0.25 (0.010) t e b c f 1.27 bsc 0.050 bsc 8 1 seating plane 1 4 5 8 a 0.25 m cb ss 0.25 m b m h c x 45 l dim min max millimeters a 1.35 1.75 a1 0.10 0.25 b 0.35 0.49 c 0.18 0.25 d 4.80 5.00 e 1.27 bsc e 3.80 4.00 h 5.80 6.20 h 0 7 l 0.40 1.25 0.25 0.50 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. dimensions are in millimeters. 3. dimension d and e do not include mold protrusion. 4. maximum mold protrusion 0.15 per side. 5. dimension b does not include mold protrusion. allowable dambar protrusion shall be 0.127 total in excess of the b dimension at maximum material condition. d e h a b e b a1 c a 0.10
139 motorola analog ic device data d suffix case 751a-03 plastic package (so-14) issue f 14 1 d suffix case 751b-05 plastic package (so-16) issue j 16 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. a b g p 7 pl 14 8 7 1 m 0.25 (0.010) b m s b m 0.25 (0.010) a s t t f r x 45 seating plane d 14 pl k c j m dim min max min max inches millimeters a 8.55 8.75 0.337 0.344 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.228 0.244 r 0.25 0.50 0.010 0.019 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 18 16 9 seating plane f j m r x 45 g 8 pl p b a m 0.25 (0.010) b s t d k c 16 pl s b m 0.25 (0.010) a s t dim min max min max inches millimeters a 9.80 10.00 0.386 0.393 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.229 0.244 r 0.25 0.50 0.010 0.019 dw, fp suffix case 751d-04 plastic package (so-20l, so20) issue e 20 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.150 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b 20 1 11 10 s a m 0.010 (0.25) b s t d 20x m b m 0.010 (0.25) p 10x j f g 18x k c t seating plane m r x 45 dim min max min max inches millimeters a 12.65 12.95 0.499 0.510 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.50 0.90 0.020 0.035 g 1.27 bsc 0.050 bsc j 0.25 0.32 0.010 0.012 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029
1310 motorola analog ic device data dw suffix case 751e-04 plastic package (so-24l, sop (16+4+4)l) issue e 24 1 dw suffix case 751f-04 plastic package (so-28l, soic28) issue e 28 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b p 12x d 24x 12 13 24 1 m 0.010 (0.25) b m s a m 0.010 (0.25) b s t t g 22x seating plane k c r x 45 m f j dim min max min max inches millimeters a 15.25 15.54 0.601 0.612 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.41 0.90 0.016 0.035 g 1.27 bsc 0.050 bsc j 0.23 0.32 0.009 0.013 k 0.13 0.29 0.005 0.011 m 0 8 0 8 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. j k f 1 15 14 28 a b 28x 14x d p s a m 0.010 (0.25) b s t m 0.010 (0.25) b m 26x g t seating plane c x 45 r m dim min max min max inches millimeters a 17.80 18.05 0.701 0.711 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.41 0.90 0.016 0.035 g 1.27 bsc 0.050 bsc j 0.23 0.32 0.009 0.013 k 0.13 0.29 0.005 0.011 m 0 8 0 8 p 10.01 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 dw suffix case 751g-02 plastic package (so-16l, sop16l, sop-8+8l) issue a 16 1 dim min max min max inches millimeters a 10.15 10.45 0.400 0.411 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.50 0.90 0.020 0.035 g 1.27 bsc 0.050 bsc j 0.25 0.32 0.010 0.012 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 m b m 0.010 (0.25) notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b p 8x g 14x d 16x seating plane t s a m 0.010 (0.25) b s t 16 9 8 1 f j r x 45 m c k
1311 motorola analog ic device data d suffix case 751k01 plastic package (so16) issue o 16 1 dw suffix case 751n01 plastic package (sop16l) issue o notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimensions a and b do not include mold protrusion. 4 maximum mold protrusion 0.15 (0.006) per side. 5 dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. dim a min max min max inches 9.80 10.00 0.368 0.393 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.229 0.244 r 0.25 0.50 0.010 0.019 18 9 16 g p c k 14 x d seating plane j r m a b m 0.25 (0.010) b s f x 45 t s a m 0.25 (0.010) b s t 16 1 dim min max min max inches millimeters a 10.15 10.45 0.400 0.411 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.50 0.90 0.020 0.035 g 1.27 bsc 0.050 bsc j 0.25 0.32 0.010 0.012 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 m b m 0.010 (0.25) notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b p g 9x d 13x seating plane t s a m 0.010 (0.25) b s t 16 9 8 1 f j r x 45 m t s s 2.54 bsc 0.100 bsc t 3.81 bsc 0.150 bsc c k
1312 motorola analog ic device data case 762-01 plastic medium power package (sip-9) issue c 1 9 fn suffix case 775-02 plastic package (plcc-20) issue c 1 notes: 1. dimensioning and tolerancing per ansi y14.5, 1982. 2. controlling dimension: millimeter. 1 seating plane 9 u m a m 0.25 (0.010) t m a m 0.25 (0.010) t m c m 0.25 (0.010) t d 9 pl c a t e b k n m v s y r g f w q x j h dim min max min max inches millimeters a 22.40 23.00 0.873 0.897 b 6.40 6.60 0.252 0.260 c 3.45 3.65 0.135 1.143 d 0.40 0.55 0.015 0.021 e 9.35 9.60 0.368 0.377 f 1.40 1.60 0.055 0.062 g 2.54 bsc 0.100 bsc h 1.51 1.71 0.059 0.067 j 0.360 0.400 0.014 0.015 k 3.95 4.20 0.155 0.165 m 30 bsc 30 bsc n 2.50 2.70 0.099 0.106 q 3.15 3.45 0.124 0.135 r 13.60 13.90 0.535 0.547 s 1.65 1.95 0.064 0.076 u 22.00 22.20 0.866 0.874 v 0.55 0.75 0.021 0.029 w 2.89 bsc 0.113 bsc x 0.65 0.75 0.025 0.029 y 2.70 2.80 0.106 0.110 notes: 1. datums l, m, and n determined where top of lead shoulder exits plastic body at mold parting line. 2. dimension g1, true position to be measured at datum t, seating plane. 3. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.250) per side. 4. dimensioning and tolerancing per ansi y14.5m, 1982. 5. controlling dimension: inch. 6. the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). m n l y brk w v d d s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t s lm s 0.010 (0.250) n s t x g1 b u z view dd 20 1 s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t s lm s 0.010 (0.250) n s t c g view s e j r z a 0.004 (0.100) t seating plane s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t h view s k k1 f g1 dim min max min max millimeters inches a 0.385 0.395 9.78 10.03 b 0.385 0.395 9.78 10.03 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 0.51 k 0.025 0.64 r 0.350 0.356 8.89 9.04 u 0.350 0.356 8.89 9.04 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y 0.020 0.50 z 2 10 2 10 g1 0.310 0.330 7.88 8.38 k1 0.040 1.02
1313 motorola analog ic device data fn suffix case 776-02 plastic package (plcc28) issue d 1 notes: 1. datums l, m, and n determined where top of lead shoulder exits plastic body at mold parting line. 2. dimension g1, true position to be measured at datum t, seating plane. 3. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.250) per side. 4. dimensioning and tolerancing per ansi y14.5m, 1982. 5. controlling dimension: inch. 6. the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). n m l v w d d y brk 28 1 view s s lm s 0.010 (0.250) n s t s lm m 0.007 (0.180) n s t 0.004 (0.100) g1 g j c z r e a seating plane s lm m 0.007 (0.180) n s t t b s lm s 0.010 (0.250) n s t s lm m 0.007 (0.180) n s t u s lm m 0.007 (0.180) n s t z g1 x view dd s lm m 0.007 (0.180) n s t k1 view s h k f s lm m 0.007 (0.180) n s t dim min max min max millimeters inches a 0.485 0.495 12.32 12.57 b 0.485 0.495 12.32 12.57 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 0.51 k 0.025 0.64 r 0.450 0.456 11.43 11.58 u 0.450 0.456 11.43 11.58 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y 0.020 0.50 z 2 10 2 10 g1 0.410 0.430 10.42 10.92 k1 0.040 1.02
1314 motorola analog ic device data fn suffix case 777-02 plastic package (plcc) issue c m suffix case 803c preliminary plastic package 1 1 20 n l m d y d k v w 1 44 brk b z u x view dd s lm m 0.007(0.180) n s t s lm m 0.007(0.180) n s t g1 s lm s 0.010 (0.25) n s t k1 f h s lm m 0.007(0.180) n s t z g g1 r a e j view s c s lm m 0.007(0.180) n s t s lm m 0.007(0.180) n s t 0.004 (0.10) t seating plane view s s lm s 0.010 (0.25) n s t s lm m 0.007(0.180) n s t notes: 1. datums l, m, and n are determined where top of lead shoulder exits plastic body at mold parting line. 2. dimension g1, true position to be measured at datum t, seating plane. 3. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.25) per side. 4. dimensioning and tolerancing per ansi y14.5m, 1982. 5. controlling dimension: inch. dim min max min max millimeters inches a 0.685 0.695 17.40 17.65 b 0.685 0.695 17.40 17.65 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 0.51 k 0.025 0.64 r 0.650 0.656 16.51 16.66 u 0.650 0.656 16.51 16.66 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y 0.020 0.50 z 2 10 2 10 g1 0.610 0.630 15.50 16.00 k1 0.040 1.02 6. the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). dim a min max min max inches 12.35 12.80 0.486 0.504 millimeters b 5.10 5.45 0.201 0.215 c 1.95 2.05 0.077 0.081 d 0.35 0.50 0.014 0.020 e 0.81 0.032 f 12.40* 0.488* g 1.15 1.39 0.045 0.055 h 0.59 0.81 0.023 0.032 j 0.18 0.27 0.007 0.011 k 1.10 1.50 0.043 0.059 l 0.05 0.20 0.001 0.008 m 0 10 n 0.50 0.85 0.020 0.033 s 7.40 8.20 0.291 0.323 0 10 notes: 6 dimensioning and tolerancing per ansi y14.5m, 1982. 7 controlling dimension: millimeter. 8 dimensions a and b do not include mold protrusion. 9 maximum mold protrusion 0.15 (0.008) per side. 10 dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.006) total in excess of the d dimension at maximum material condition. *approximate a 0.13 (0.005) m tb ss 0.13 (0.005) m b m s 10 pl g d 20 pl l c 0.10 (0.004) seating plane k n j m e 1 20 11 10 a f b t
1315 motorola analog ic device data tv suffix case 821c-04 plastic package (15-pin zip) issue d 1 15 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension r does not include mold flash or protrusions. 4. dimension b does not include mold flash or protrusions. 5. mold flash or protrusions shall not exceed 0.010 (0.250). 6. dimension d does not include dambar protrusion. allowable protrusion shall be 0.003 (0.076) total in excess of the d dimension. at maximum material condition. dim min max min max millimeters inches a 0.684 0.694 17.374 17.627 b 0.784 0.792 19.914 20.116 c 0.173 0.181 4.395 4.597 d 0.024 0.031 0.610 0.787 e 0.058 0.062 1.473 1.574 g 0.050 bsc 1.270 bsc h 0.169 bsc 4.293 bsc j 0.018 0.024 0.458 0.609 k 0.700 0.710 17.780 18.034 l 0.200 bsc 5.080 bsc m 0.148 0.151 3.760 3.835 r 0.416 0.426 10.567 10.820 s 0.157 0.167 3.988 4.242 u 0.105 0.115 2.667 2.921 v 0.868 ref 22.047 ref y 0.625 0.639 15.875 16.231 b d u pin 15 15x g r a pin 1 m q p p m 0.010 (0.254) q s t j 15x m 0.024 (0.610) t k l h s v e c y t seating plane t suffix case 821d-03 plastic package issue c notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension r does not include mold flash or protrusions. 4. dimension b does not include mold flash or protrusions. 5. mold flash or protrusions shall not exceed 0.010 (0.250). 6. deleted 7. dimension d does not include dambar protrusion. allowable protrusion shall be 0.003 (0.076) total in excess of the d dimension. at maximum material condition. dim min max min max millimeters inches a 0.681 0.694 17.298 17.627 b 0.784 0.792 19.914 20.116 c 0.173 0.181 4.395 4.597 d 0.024 0.031 0.610 0.787 e 0.058 0.062 1.473 1.574 f g 0.050 bsc 1.270 bsc h 0.110 bsc 0.407 0.584 j 0.018 0.024 0.458 0.609 k q 0.148 0.151 3.760 3.835 r 0.416 0.426 10.567 10.820 u 0.110 bsc 2.794 bsc y 0.503 ref 12.776 ref b d u pin 15 15x g r a pin 1 q l p p m 0.010 (0.254) l s t j 15x m 0.024 (0.610) t k h e c y t seating plane f 7x 0.016 0.023 1.078 1.086 2.794 bsc 27.382 27.584 1 15
1316 motorola analog ic device data ftb suffix case 824d01 plastic package (tqfp44) issue o 1 ???? ???? notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u and z to be determined at datum plane ab. 5. dimensions s and v to be determined at seating plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.530 (0.021). 44 1 34 33 11 12 22 23 detail aa z t a s tu m 0.20 (0.008) z s ab 0.05 (0.002) tu s b v u m y e h c ab detail ad 0.10 (0.004) k w x view ad t, u, z f n section aeae j d base metal plating ae ae g 0.05 (0.002) z detail aa dim min max min max inches millimeters a 9.950 10.050 0.392 0.396 b 9.950 10.050 0.392 0.396 c 1.400 1.600 0.055 0.063 d 0.300 0.450 0.012 0.018 e 1.350 1.450 0.053 0.057 f 0.300 0.400 0.012 0.016 g 0.800 bsc 0.031 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.450 0.550 0.018 0.022 l 8.000 bsc 0.315 bsc m 12 ref 12 ref n 0.090 0.160 0.004 0.006 q 1 5 1 5 r 0.100 0.200 0.004 0.008 s 11.900 12.100 0.469 0.476 v 11.900 12.100 0.469 0.476 w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref y 12 ref 12 ref l l s tu m 0.20 (0.008) z s ac s tu m 0.20 (0.008) z s ab s tu m 0.20 (0.008) z s ac ac q s tu m 0.20 (0.008) z s ac r
1317 motorola analog ic device data fb suffix case 824e02 plastic package (qfp) issue a ??? ??? 44 1 34 33 11 12 22 23 view y n l a s lm m 0.20 (0.008) n s h s lm m 0.20 (0.008) n s t 0.05 (0.002) lm s b v m t m y e w c h datum plane view p 0.01 (0.004) h datum plane r2 k a1 c1 view p dim min max min max inches millimeters a 9.90 10.10 0.390 0.398 b 9.90 10.10 0.390 0.398 c 2.00 2.21 0.079 0.087 d 0.30 0.45 0.0118 0.0177 e 2.00 2.10 0.079 0.083 f 0.30 0.40 0.012 0.016 g 0.80 bsc 0.031 bsc j 0.13 0.23 0.005 0.009 k 0.65 0.95 0.026 0.037 m 5 10 5 10 s 12.95 13.45 0.510 0.530 v 12.95 13.45 0.510 0.530 w 0.000 0.210 0.000 0.008 y 5 10 5 10 a1 0.450 ref 0.170 0.018 ref 0.007 b1 l, m, n s lm m 0.20 (0.008) n s t f b1 section j1j1 j d base metal g 40x r r1 r 1 2 plating 44 pl j1 j1 g c1 1.600 ref 0.063 ref r1 r2 5 10 5 10 1 2 0.130 0.005 0.130 0.300 0.005 0.012 0.130 0.300 0.005 0.012 0 7 0 7 pin 1 ident s lm m 0.20 (0.008) n s h 0.05 (0.002) n s lm m 0.20 (0.008) n s t view y 3 pl notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums l, m and n to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane t. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane h. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.530 (0.021). 1 44
1318 motorola analog ic device data fb suffix case 840f01 plastic package issue o ?? ?? ?? ?? 0.20 (0.008) ac m z tu s s 0.20 (0.008) ab m z tu s s 0.20 (0.008) ac m z tu s s 0.20 (0.008) ab m z tu s s 0.20 (0.008) ac m z tu s s z 0.050 (0.002) 0.050 (0.002) tu z u t l detail aa l 1 64 49 48 16 33 17 32 a s b v 0.10 (0.004) ab e h c y m detail ad ac r detail ad w k x q j d n base section aeae f metal detail aa g ae ae p t, u, z notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u and z to be determined at datum plane ac. 5. dimensions s and v to be determined at seating plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010 ) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). dim a min max min max inches 9.950 10.050 0.392 0.396 millimeters b 9.950 10.050 0.392 0.396 c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.500 bsc 0.020 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.450 0.550 0.018 0.022 l m n 0.090 0.160 0.004 0.006 p q 1 5 r 0.100 0.200 0.004 0.008 s 11.900 12.100 0.469 0.476 v 11.900 12.100 0.469 0.476 w x y 1.000 ref 12 ref 0.200 ref 0.039 ref 0.008 ref 0.010 bsc 0.250 bsc 7.500 bsc 0.295 bsc 5 12 ref 5 12 ref 5 12 ref 5 5 1 5 5 5 5 1 64
1319 motorola analog ic device data dm suffix case 846a02 plastic package (micro8) issue c 1 s b m 0.08 (0.003) a s t dim min max min max inches millimeters a 2.90 3.10 0.114 0.122 b 2.90 3.10 0.114 0.122 c 1.10 0.043 d 0.25 0.40 0.010 0.016 g 0.65 bsc 0.026 bsc h 0.05 0.15 0.002 0.006 j 0.13 0.23 0.005 0.009 k 4.75 5.05 0.187 0.199 l 0.40 0.70 0.016 0.028 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. b a d k g pin 1 id 8 pl 0.038 (0.0015) t seating plane c h j l 8
1320 motorola analog ic device data fb suffix case 848b-04 plastic package (tqfp52) issue c 1 52 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums a, b and d to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane c. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane h. 7. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the d dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. detail a l 39 40 26 27 1 52 14 13 l a b v s ab m 0.20 (0.008) d s h ab 0.05 (0.002) s ab m 0.20 (0.008) d s c d b v b s ab m 0.20 (0.008) d s h ab 0.05 (0.002) s ab m 0.20 (0.008) d s c h 0.10 (0.004) c seating plane datum plane m g h e c m detail c u q x w k t r detail c dim min max min max inches millimeters a 9.90 10.10 0.390 0.398 b 9.90 10.10 0.390 0.398 c 2.10 2.45 0.083 0.096 d 0.22 0.38 0.009 0.015 e 2.00 2.10 0.079 0.083 f 0.22 0.33 0.009 0.013 g 0.65 bsc 0.026 bsc h 0.25 0.010 j 0.13 0.23 0.005 0.009 k 0.65 0.95 0.026 0.037 l 7.80 ref 0.307 ref m 5 10 5 10 n 0.13 0.17 0.005 0.007 q 0 7 0 7 r 0.13 0.30 0.005 0.012 s 12.95 13.45 0.510 0.530 t 0.13 0.005 u 0 0 v 12.95 13.45 0.510 0.530 w 0.35 0.45 0.014 0.018 x 1.6 ref 0.063 ref b b detail a a, b, d jn d f base metal section bb s ab m 0.02 (0.008) d s c
1321 motorola analog ic device data fb suffix case 848d03 plastic package issue c f notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums l, m and n to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane t. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane -h-. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the lead width to exceed 0.46 (0.018). minimum space between protrusion and adjacent lead or protrusion 0.07 (0.003). ??? ??? view aa view aa 2 x r r1 ab ab view y section abab rotated 90 clockwise dim a min max min max inches 10.00 bsc 0.394 bsc millimeters a1 5.00 bsc 0.197 bsc b 10.00 bsc 0.394 bsc b1 5.00 bsc 0.197 bsc c 1.70 0.067 c1 0.05 0.20 0.002 0.008 c2 1.30 1.50 0.051 0.059 d 0.20 0.40 0.008 0.016 e 0.45 0.030 f 0.22 0.35 0.009 0.014 g 0.65 bsc 0.75 0.018 0.026 bsc j 0.07 0.20 0.003 0.008 k 0.50 ref 0.020 ref r1 0.08 0.20 0.003 0.008 s 12.00 bsc 0.472 bsc s1 6.00 bsc 0.236 bsc u 0.09 0.16 0.004 0.006 v 12.00 bsc 0.472 bsc v1 6.00 bsc 0.236 bsc w 0.20 ref 0.008 ref z 1.00 ref 0.039 ref c l x x=l, m, n 1 13 14 26 27 39 40 52 4x tips 4x n 0.20 (0.008) h lm n 0.20 (0.008) t lm 3x view y seating plane c 0.10 (0.004) t 4x q 3 4x q 2 s 0.05 (0.002) 0.25 (0.010) gage plane c2 c1 w k e z s lm m 0.13 (0.005) n s t plating base metal d j u b v b1 a s v1 a1 s1 l n m h t q 1 q g q 1 q q 3 q 2 07 12 513 07 0 0 ref 12 ref 13 5 52 1
1322 motorola analog ic device data b suffix case 85901 plastic package (sdip) issue o 56 1 a b t 56 29 128 seating plane j 56 pl d 56 pl s a m 0.25 (0.010) t n f g e s b m 0.25 (0.010) t k c h l m dim min max min max millimeters inches a 2.035 2.065 51.69 52.45 b 0.540 0.560 13.72 14.22 c 0.155 0.200 3.94 5.08 d 0.014 0.022 0.36 0.56 e 0.035 bsc 0.89 bsc f 0.032 0.046 0.81 1.17 g 0.070 bsc 1.778 bsc h 0.300 bsc 7.62 bsc j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.600 bsc 15.24 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.02 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimensions a and b do not include mold flash. maximum mold flash 0.25 (0.010) b suffix case 85801 plastic package issue o a 121 42 22 b seating plane t s a m 0.25 (0.010) t s b m 0.25 (0.010) t l h m j 42 pl d 42 pl f g n k c notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimensions a and b do not include mold flash. maximum mold flash 0.25 (0.010). dim min max min max millimeters inches a 1.435 1.465 36.45 37.21 b 0.540 0.560 13.72 14.22 c 0.155 0.200 3.94 5.08 d 0.014 0.022 0.36 0.56 f 0.032 0.046 0.81 1.17 g 0.070 bsc 1.778 bsc h 0.300 bsc 7.62 bsc j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.600 bsc 15.24 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.02 42 1
1323 motorola analog ic device data fb, ftb suffix case 873-01 plastic package (tqfp32) issue a 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums a, b and d to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane c. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane h. 7. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the d dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. u b l detail a l a 32 25 24 16 17 18 9 v s ab m 0.20 (0.008) d s c s ab m 0.20 (0.008) d s h ab 0.05 (0.002) s ab m 0.20 (0.008) d s c ab 0.05 (0.002) s ab m 0.20 (0.008) d s h d a s b c seating plane h datum plane m g detail c m h c e 0.01 (0.004) h datum plane t detail c r k q x detail a b b p a, b, d s ab m 0.20 (0.008) d s c j f n d section bb base metal view rotated 90 clockwise dim min max min max inches millimeters a 6.95 0.274 0.280 b 6.95 7.10 0.274 0.280 c 1.40 1.60 0.055 0.063 d 0.273 0.373 0.010 0.015 e 1.30 1.50 0.051 0.059 f 0.273 0.010 g 0.80 bsc 0.031 bsc h 0.20 0.008 j 0.119 0.197 0.005 0.008 k 0.33 0.57 0.013 0.022 l 5.6 ref 0.220 ref m 6 8 6 8 n 0.119 0.135 0.005 0.005 p 0.40 bsc 0.016 bsc q 5 10 5 10 r 0.15 0.25 0.006 0.010 s 8.85 9.15 0.348 0.360 t 0.15 0.25 0.006 0.010 u 5 11 5 11 v 8.85 9.15 0.348 0.360 x 1.00 ref 0.039 ref 7.10
1324 motorola analog ic device data t suffix case 894-03 plastic package (23-pin szip) issue b 1 23 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension r does not include mold flash or protrusions. 4. dimension b does not include mold flash or protrusions. 5. mold flash or protrusions shall not exceed 0.010 (0.250). 6. dimension d does not include dambar protrusion. allowable protrusion shall be 0.003 (0.076) total in excess of the d dimension at maximum material condition. dim a min max min max millimeters 0.684 0.694 17.374 17.627 inches b 1.183 1.193 30.048 30.302 c 0.175 0.179 4.445 4.547 d 0.026 0.031 0.660 0.787 e 0.058 0.062 1.473 1.574 f 0.165 0.175 4.191 4.445 g 0.050 bsc 1.270 bsc h 0.169 bsc 4.293 bsc j 0.014 0.020 0.356 0.508 k 0.625 0.639 15.875 16.231 l 0.770 0.790 19.558 20.066 m 0.148 0.152 3.760 3.861 n 0.148 0.152 3.760 3.861 p 0.390 bsc 9.906 bsc r 0.416 0.424 10.566 10.770 s 0.157 0.167 3.988 4.242 u 0.105 0.115 2.667 2.921 v 0.868 ref 22.047 ref w 0.200 bsc 5.080 bsc y 0.700 0.710 17.780 18.034 pin 1 d n m a p l b f u r g pin 23 23x s q m 0.010 (0.254) n s t y k v h s e c w m 0.024 (0.610) t j 23x t seating plane
1325 motorola analog ic device data fta suffix case 93202 plastic package (tqfp48) issue d dim a min max min max inches 7.000 bsc 0.276 bsc millimeters a1 3.500 bsc 0.138 bsc b 7.000 bsc 0.276 bsc b1 3.500 bsc 0.138 bsc c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.500 basic 0.020 basic h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.500 0.700 0.020 0.028 m 12 ref 12 ref n 0.090 0.160 0.004 0.006 p 0.250 basic 0.010 basic q 1 5 1 5 r 0.150 0.250 0.006 0.010 s 9.000 bsc 0.354 bsc s1 4.500 bsc 0.177 bsc v 9.000 bsc 0.354 bsc v1 4.500 bsc 0.177 bsc w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u, and z to be determined at datum plane ab. 5. dimensions s and v to be determined at seating plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.250 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). 8. minimum solder plate thickness shall be 0.0076 (0.0003). 9. exact shape of each corner is optional. ??? ??? ??? a a1 t z 0.200 (0.008) ab tu u 4x z 0.200 (0.008) ac tu 4x b b1 1 12 13 24 25 36 37 48 z s1 s v v1 p ae ae t, u, z detail y detail y base metal n j f d s tu m 0.080 (0.003) z s ac section aeae ab ac ad g 0.080 (0.003) ac m top & bottom q w k x e c h 0.250 (0.010) gauge plane r 9 detail ad 48 1
1326 motorola analog ic device data d2t suffix case 93603 plastic package issue b d2t suffix case 936a02 plastic package (d 2 pak) issue a v u terminal 4 a 12 3 k f b j s h d g c m 0.010 (0.254) t e m l p n r t optional chamfer 5 ref a 123 k b s h d g c e m l p n r v u terminal 6 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. tab contour optional within dimensions a and k. 4. dimensions u and v establish a minimum mounting surface for terminal 6. 5. dimensions a and b do not include mold flash or gate protrusions. mold flash and gate protrusions not to exceed 0.025 (0.635) maximum. dim a min max min max millimeters 0.386 0.403 9.804 10.236 inches b 0.356 0.368 9.042 9.347 c 0.170 0.180 4.318 4.572 d 0.026 0.036 0.660 0.914 e 0.045 0.055 1.143 1.397 g 0.067 bsc 1.702 bsc h 0.539 0.579 13.691 14.707 k 0.050 ref 1.270 ref l 0.000 0.010 0.000 0.254 m 0.088 0.102 2.235 2.591 n 0.018 0.026 0.457 0.660 p 0.058 0.078 1.473 1.981 r 5 ref s 0.116 ref 2.946 ref u 0.200 min 5.080 min v 0.250 min 6.350 min 45 m 0.010 (0.254) t t optional chamfer 5 ref 5 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. tab contour optional within dimensions a and k. 4. dimensions u and v establish a minimum mounting surface for terminal 4. 5. dimensions a and b do not include mold flash or gate protrusions. mold flash and gate protrusions not to exceed 0.025 (0.635) maximum. dim a min max min max millimeters 0.386 0.403 9.804 10.236 inches b 0.356 0.368 9.042 9.347 c 0.170 0.180 4.318 4.572 d 0.026 0.036 0.660 0.914 e 0.045 0.055 1.143 1.397 f 0.051 ref 1.295 ref g 0.100 bsc 2.540 bsc h 0.539 0.579 13.691 14.707 j 0.125 max 3.175 max k 0.050 ref 1.270 ref l 0.000 0.010 0.000 0.254 m 0.088 0.102 2.235 2.591 n 0.018 0.026 0.457 0.660 p 0.058 0.078 1.473 1.981 r s 0.116 ref 2.946 ref u 0.200 min 5.080 min v 0.250 min 6.350 min 1 2 3 1 5
1327 motorola analog ic device data dt, dtb suffix case 948e02 plastic package (tssop20) issue a dtb suffix case 948f01 plastic package (tssop16, tssop16l) issue o dim a min max min max inches 6.60 0.260 millimeters b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.27 0.37 0.011 0.015 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 1 10 11 20 pin 1 ident a b t 0.100 (0.004) c d g h section nn k k1 jj1 n n m f w seating plane v u s u m 0.10 (0.004) v s t 20x ref k l l/2 2x s u 0.15 (0.006) t detail e 0.25 (0.010) detail e 6.40 0.252 s u 0.15 (0.006) t ??? ??? ??? dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.18 0.28 0.007 0.011 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane w. section nn seating plane ident. pin 1 1 8 16 9 detail e j j1 b c d a k k1 h g detail e f m l 2x l/2 u s u 0.15 (0.006) t s u 0.15 (0.006) t s u m 0.10 (0.004) v s t 0.10 (0.004) t v w 0.25 (0.010) 16x ref k n n notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane w. 1 20 1 16
1328 motorola analog ic device data dtb suffix case 948g01 plastic package (tssop14) issue o 1 14 dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4 dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5 dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6 terminal numbers are shown for reference only. 7 dimension a and b are to be determined at datum plane w. s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l u seating plane 0.10 (0.004) t ??? ??? section nn detail e j j1 k k1 detail e f m w 0.25 (0.010) 8 14 7 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t v 14x ref k n n
1329 motorola analog ic device data dtb suffix case 948h01 plastic package issue o dim min max min max inches millimeters a 7.70 7.90 0.303 0.311 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.27 0.37 0.011 0.015 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane w. s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l u seating plane 0.10 (0.004) t ??? ??? section nn detail e j j1 k k1 detail e f m w 0.25 (0.010) 13 24 12 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t v 24x ref k n n 1 24
1330 motorola analog ic device data dtb suffix case 948j01 plastic package (tssop8) issue o 1 8 ??? ??? dim min max min max inches millimeters a 2.90 3.10 0.114 0.122 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4 dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5 dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6 terminal numbers are shown for reference only. 7 dimension a and b are to be determined at datum plane w. section nn seating plane ident. pin 1 1 4 8 5 see detail e j j1 b c d a k k1 h g detail e f m l 2x l/2 u s u 0.15 (0.006) t s u 0.15 (0.006) t s u m 0.10 (0.004) v s t 0.10 (0.004) t v w 0.25 (0.010) 8x ref k n n m suffix case 96701 plastic package (eiaj20) issue o dim min max min max inches 2.05 0.081 millimeters 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.18 0.27 0.007 0.011 12.35 12.80 0.486 0.504 5.10 5.45 0.201 0.215 1.27 bsc 0.050 bsc 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0 0.70 0.90 0.028 0.035 0.81 0.032 a 1 h e q 1 l e 10 0 10 notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimensions d and e do not include mold flash or protrusions and are measured at the parting line. mold flash or protrusions shall not exceed 0.15 (0.006) per side. 4 terminal numbers are shown for reference only. 5 the lead width dimension (b) does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the lead width dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. minimum space between protrusions and adjacent lead to be 0.46 ( 0.018). h e a 1 l e q 1 c a z d e 20 110 11 b m 0.13 (0.005) e 0.10 (0.004) view p detail p m l a b c d e e l m z 1 20
1331 motorola analog ic device data ftb suffix case 97601 plastic package (tqfp20) issue o dim min max min max inches millimeters a 4.000 bsc 0.157 bsc a1 2.000 bsc 0.079 bsc b 4.000 bsc 0.157 bsc b1 2.000 bsc 0.079 bsc c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.650 bsc 0.026 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.500 0.700 0.020 0.028 m 12 ref 12 ref n 0.090 0.160 0.004 0.006 p 0.250 bsc 0.010 bsc q 1 5 1 5 r 0.150 0.250 0.006 0.010 s 6.000 bsc 0.236 bsc s1 3.000 bsc 0.118 bsc v 6.000 bsc 0.236 bsc v1 3.000 bsc 0.118 bsc w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u, and z to be determined at datum plane ab. 5. dimensions s and v to be determined at datum plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.250 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). 8. minimum solder plate thickness shall be 0.0076 (0.0003). 9. exact shape of each corner is optional. detail ad detail y 4x 4x 1 5 6 11 16 10 15 20 s s1 a a1 u tu 0.200 (0.008) z ab 9 b b1 t v v1 z tu 0.200 (0.008) z ab ac ab 0.080 (0.003) ac r detail ad detail y ae ae k x w g top & bottom section aeae m q ce h 0.250 (0.010) gauge plane ???? ???? ???? f d n j t, u, z s tu s 0.080 (0.003) z s ac 1 20
1332 motorola analog ic device data fta suffix case 97701 plastic package issue o dim min max min max inches millimeters a 4.000 bsc 0.157 bsc a1 2.000 bsc 0.079 bsc b 4.000 bsc 0.157 bsc b1 2.000 bsc 0.079 bsc c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.500 bsc 0.020 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.500 0.700 0.020 0.028 m 12 ref 12 ref n 0.090 0.160 0.004 0.006 p 0.250 bsc 0.010 bsc q 1 5 1 5 r 0.150 0.250 0.006 0.010 s 6.000 bsc 0.236 bsc s1 3.000 bsc 0.118 bsc v 6.000 bsc 0.236 bsc v1 3.000 bsc 0.118 bsc w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u, and z to be determined at datum plane ab. 5. dimensions s and v to be determined at datum plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.250 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). 8. minimum solder plate thickness shall be 0.0076 (0.0003). 9. exact shape of each corner is optional. detail ad detail y 4x 4x 1 6 7 13 19 12 18 24 s s1 a a1 u tu 0.200 (0.008) z ab 9 b b1 t v v1 z tu 0.200 (0.008) z ab ac ab 0.080 (0.003) ac r detail ad detail y ae ae k x w g top & bottom section aeae m q ce h 0.250 (0.010) gauge plane ???? ???? ???? f d n j t, u, z p s tu s 0.080 (0.003) z s ac 1 24
1333 motorola analog ic device data n suffix case 121201 plastic package (sot23) issue o 1 dim min max millimeters a1 0.00 0.10 a2 1.00 1.30 b 0.30 0.50 c 0.10 0.25 d 2.80 3.00 e 2.50 3.10 e1 1.50 1.80 e 0.95 bsc e1 1.90 bsc l l1 0.45 0.75 notes: 1. dimensions are in millimeters. 2. interpret dimensions and tolerances per asme y14.5m, 1994. 3. datum c is a seating plane. a 1 5 23 4 d e1 b l1 e e e1 c m 0.10 c s b s a b 5x a2 a1 s 0.05 c l 0.20 h suffix case 121301 plastic package (sot89) issue o 1 dim min max millimeters a2 1.40 1.60 b 0.37 0.57 b1 0.32 0.52 c 0.30 0.50 d 4.40 4.60 d1 1.50 1.70 e 4.25 e1 2.40 2.60 e 1.50 bsc e1 3.00 bsc l1 0.80 notes: 1. dimensions are in millimeters. 2. interpret dimensions and tolerancing per asme y14.5m, 1994. 3. datum c is a seating plane. a d e1 b l1 e d1 e e1 c m 0.10 c s b s a m 0.10 c s b s a b b1 2x a2 c

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